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Tech Digest Vol.28 Num.1 Cover

Electronic and Electro-Optical Packaging
Volume 28, Number 1 (2008)

Electronic and electro-optical packaging is key to the effective use of electronics and optics in modern system applications. This issue of the Technical Digest examines APL’s current and future advances in packaging, which build on a more than 65-year history of developing innovative packaging solutions to challenging problems in space, under water, on sea and land, and in the air. Package structures range from the largest satellites and instruments to the smallest components (e.g., carbon nanotubes). The cover illustrates electronic circuit boards of various types fabricated at APL. The central image is our latest bendable packaging technology, which consists of thinned die on a flexible substrate with an overall thickness slightly larger than the diameter of a human hair.

Electronic and Electro-Optical Packaging at APL: Guest Editor’s Introduction

Harry K. Charles Jr.

Spacecraft Packaging

Edward D. Schaefer, Vincent L. Bailey, Carl J. Ercol, Sharon X. Ling, Ron C. Schulze, and Steven R. Vernon

Harsh Environments: Space Radiation Environment, Effects, and Mitigation

Richard H. Maurer, Martin E. Fraeman, Mark N. Martin, and David R. Roth

Semiconductor Devices: Moore Marches On

Dennis K. Wickenden

Microelectronic Substrates for Optoelectronic Packages

A. Shaun Francomacaro, Dennis K. Wickenden, S. John Lehtonen, and Francisco Tejada

Reliable Miniature Electronic and Optical Interconnects for Low-Volume Applications

Guy V. Clatterbaugh, Charles V. Banda, and S. John Lehtonen

Polymer Adhesives and Encapsulants for Microelectronic Applications

Richard C. Benson, Dawnielle Farrar, and Joseph A. Miragliotta

Technology Advances and Globalization in Electronic and Electro-Optical Packaging

Harry K. Charles Jr.


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