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Tech Digest Vol.20 Num.1 Cover

Electronic Packaging
Volume 20, Number 1 (January–March 1999)

Electronic packaging is the key to the effective use of electronics in modern systems technology. For more than half a century, APL has provided innovative electronic packaging solutions for major system development efforts, ranging from the VT fuze to the Near Earth Asteroid Rendezvous spacecraft.

Editorial

The Impact of Electronic Packaging at APL: Guest Editor's Introduction

H. K. Charles, Jr.

History of Electronic Packaging at APL: From the VT Fuze to the NEAR Spacecraft

G. D. Wagner

Modern Electronic Packaging Technology

M. G. Bevan and B. M. Romenesko

Some Key Issues in Microelectronic Packaging

G. V. Clatterbaugh, P. Vichot, and H. K. Charles, Jr.

Miniaturization of Space Electronics with Chip-on-Board Technology

B. Q. Le, E. Nhan, R. H. Maurer, R. E. Jenkins, A. L. Lew, H. S. Feldmesser, and J. R. Lander

Multichip Module Substrated

N. A. Blum, H. K. Charles, Jr., and A. S. Francomacaro

Transmit/Receive Module Packaging: Electrical Design Issues

B. A. Kopp, C. R. Moore, and R. V. Coffman

System-Level Packaging: Putting It All Together

D. S. Mehoke, H. S. Feldmesser, and P. D. Grimm

The Case for Plastic-Encapsulated Microcircuits in Spaceflight Applications

A. F. Moor, A. Casanovas, and S. R. Purwin

APL's Packaging Future: The Next Few Years

H. K. Charles, Jr.

Electronic Packaging Research and Education: A Model for the 21st Century

R. R. Tummula

MISCELLANEA

In Memoriam: Walter G. Berl (1917–1998)

K. Moorjani

MISCELLANEA

Writing and Research and Development Awards

L. L. Maier-Tyler

MISCELLANEA

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