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Electronic and Electro-Optical Packaging at APL: Guest Editor’s Introduction
Harry K. Charles Jr.
Edward D. Schaefer, Vincent L. Bailey, Carl J. Ercol, Sharon X. Ling,
Ron C. Schulze, and Steven R. Vernon
Harsh Environments: Space Radiation Environment, Effects, and Mitigation
Richard H. Maurer, Martin E. Fraeman, Mark N. Martin, and David R. Roth
Semiconductor Devices: Moore Marches On
Dennis K. Wickenden
Microelectronic Substrates for Optoelectronic Packages
A. Shaun Francomacaro, Dennis K. Wickenden, S. John Lehtonen,
and Francisco Tejada
Reliable Miniature Electronic and Optical
Interconnects for Low-Volume Applications
Guy V. Clatterbaugh, Charles V. Banda, and S. John Lehtonen
Polymer Adhesives and Encapsulants for Microelectronic Applications
Richard C. Benson, Dawnielle Farrar, and Joseph A. Miragliotta
Technology Advances and Globalization in Electronic and Electro-Optical Packaging
Harry K. Charles Jr.
Publications, Presentations, and Conferences with Proceedings
Compiled by L. M. Mercer
Inside Front Cover Editorial Information
Inside Back Cover Illustration
|The Cover: Electronic and electro-optical packaging is key to the effective use of electronics and optics in modern system applications. This issue of the Technical Digest examines APL’s current and future advances in packaging, which build on a more than 65-year history of developing innovative packaging solutions to challenging problems in space, under water, on sea and land, and in the air. Package structures range from the largest satellites and instruments to the smallest components (e.g., carbon nanotubes). The cover illustrates electronic circuit boards of various types fabricated at APL. The central image is our latest bendable packaging technology, which consists of thinned die on a flexible substrate with an overall thickness slightly larger than the diameter of a human hair.
Printable high-resolution version of cover in Acrobat PDF format.
© 2008 by The Johns Hopkins University Applied Physics Laboratory
The electronic version of the Johns Hopkins APL Technical Digest
was created by the Technical Communications Group (TST).