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Electronic and Electro-Optical Packaging at APL

          Electronic and Electro-Optical Packaging at APL: Guest Editor’s Introduction
          Harry K. Charles Jr.

          Spacecraft Packaging
          Edward D. Schaefer, Vincent L. Bailey, Carl J. Ercol, Sharon X. Ling,
          Ron C. Schulze, and Steven R. Vernon

          Harsh Environments: Space Radiation Environment, Effects, and Mitigation
          Richard H. Maurer, Martin E. Fraeman, Mark N. Martin, and David R. Roth

          Semiconductor Devices: Moore Marches On
          Dennis K. Wickenden

          Microelectronic Substrates for Optoelectronic Packages
          A. Shaun Francomacaro, Dennis K. Wickenden, S. John Lehtonen,
          and Francisco Tejada

          Reliable Miniature Electronic and Optical
          Interconnects for Low-Volume Applications
          Guy V. Clatterbaugh, Charles V. Banda, and S. John Lehtonen

          Polymer Adhesives and Encapsulants for Microelectronic Applications
          Richard C. Benson, Dawnielle Farrar, and Joseph A. Miragliotta

          Technology Advances and Globalization in Electronic and Electro-Optical Packaging
          Harry K. Charles Jr.

   MISCELLANEA

          Publications, Presentations, and Conferences with Proceedings
          Compiled by L. M. Mercer

          Inside Front Cover Editorial Information

          Inside Back Cover Illustration
The Cover: Electronic and electro-optical packaging is key to the effective use of electronics and optics in modern system applications. This issue of the Technical Digest examines APL’s current and future advances in packaging, which build on a more than 65-year history of developing innovative packaging solutions to challenging problems in space, under water, on sea and land, and in the air. Package structures range from the largest satellites and instruments to the smallest components (e.g., carbon nanotubes). The cover illustrates electronic circuit boards of various types fabricated at APL. The central image is our latest bendable packaging technology, which consists of thinned die on a flexible substrate with an overall thickness slightly larger than the diameter of a human hair.

Printable high-resolution version of cover in Acrobat PDF format.


© 2008 by The Johns Hopkins University Applied Physics Laboratory

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