Thermal Interface and Switch using Carbon Nanotube Arrays

Reference#: P01982

There are many applications that benefit from increasing heat flow between two surfaces. The flow of heat between two surfaces depends on how well phonons couple from one surface to the other, the inverse of which is described by the thermal contact resistance. In many applications, the surfaces can be of different materials or fabricated with temperature restrictions, such as for electronic components, which can reduce the quality of the bond between the surfaces, and therefore increase the thermal resistance.

The present invention uses carbon nanotubes in a thermal interface to increase the heat flow between two surfaces, and, in particular, uses arrays of aligned or densely packed carbon nanotubes to improve thermal contact in a reusable thermal interface, such as a thermal interface for use in a thermal switch.

Patent Status: U.S. patent(s) 7416019 issued.

Dr. G. R. Jacobovitz
Phone: (443) 778-9899

Additional References:

Link to U.S. Patent and Trademark Office