Technologies


Universal Adapter for Integrated Circuit

Reference#: P01703


A semiconductor die adapter assembly includes a semiconductor die cut from a wafer, the die having an active surface including bond pads. A die adapter, also having bond pads, is bonded to the semiconductor die. Die-to-adapter connectors electrically connect the die bond pads to the adapter bond pads. Finally, adapter-to-substrate connectors electrically connect the adapter bond pads to a device substrate. Having bond pads on the die adapter eliminates the need to break and remake the electrical connections to the original bond pads on the die during burn-in testing of the die.

Patent Status: U.S. patent(s) 6881593 issued.

*JHU/APL is seeking an exclusive licensee and development partner for this technology

CONTACT:
Mr. K. Chao
Phone: (443) 778-7927
ott-techmanager6@jhuapl.edu